| 摘要 |
A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1) wherein Ar is a C6-C20 aryl group, R1 is a C1-C6 hydrocarbon group, R2 is a C1-C4 hydrocarbon group, W1 is oxygen or sulfur, RO is a C1-C6 hydrocarbon group, a=0-10, g=0-3, 0<m<1, 0<n<1, m+n=1 and m:n=1:10 to 1:1, and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H. for 168 hours:
|
