发明名称 Semiconductor device and manufacturing method of semiconductor device
摘要 In one aspect of the present invention, a semiconductor device may include a semiconductor substrate; a first gate dielectric layer provided on the semiconductor substrate, the relative dielectric constant ratio of the first gate dielectric layer being no less than 8; a second gate dielectric layer provided on the semiconductor substrate, the relative dielectric constant ratio of the second gate dielectric layer being no less than 8; a first gate electrode provided on the first gate dielectric layer and made of germanide which is a metallic compound containing a metal element of a rare earth metal; and a second gate electrode provided on the second gate dielectric layer and made of silicide which is a metallic compound containing the same metal element of a rare earth metal as the germanide in the first gate electrode.
申请公布号 US7696585(B2) 申请公布日期 2010.04.13
申请号 US20070933845 申请日期 2007.11.01
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 TAKAYANAGI MARIKO
分类号 H01L29/76 主分类号 H01L29/76
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