发明名称 POLYAMIDE COMPOSITION
摘要 Provided is a polyamide composition comprising 100 parts by weight of (A) a semiaromatic polyamide having dicarboxylic acid units mainly composed of aromatic dicarboxylic acid units and diamine units mainly composed of aliphatic diamine units having 4 to 14 carbon atoms and containing not more than 15 µ eq/g of terminal amino groups; and 0.01 to 5 parts by weight of (B) a copper compound. The polyamide compositions of the present invention have excellent heat aging characteristics, as well as excellent mechanical characteristics, low-water-absorption property and dimensional stability. The polyamide compositions of the present invention can be used as molding materials for industrial materials or household goods and are, especially, suited for a various article, which is used at a high temperature, such as engine room parts of an automobile.
申请公布号 CA2389077(C) 申请公布日期 2010.04.13
申请号 CA20022389077 申请日期 2002.06.05
申请人 KURARAY CO., LTD. 发明人 OKA, HIDEAKI;HARA, TETSUYA;SASAKI, SHIGERU
分类号 C08L77/06;C08L77/10;C08G69/26;C08G69/32;C08K3/16;C08L33/24 主分类号 C08L77/06
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