发明名称 |
WAFER LEVEL PACKAGING IMAGE SENSOR MODULE HAVING A LENS ACTUATOR AND THE MATHOD OF MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: A wafer-level packaging image sensor module and a method for manufacturing the same are provided to control the focus of the image sensor by including a lens driving unit with an electro-active polymer. CONSTITUTION: An image sensor, a circuit unit, and a lower electrode are arranged on the upper side of a wafer(100). A lens driving unit(300) is formed on the upper side of the lower electrode and is composed of an electro-active polymer. An upper electrode(350) is formed on the upper side of the lens driving unit. A lens unit(500) is formed on the upper side of the upper electrode. An adhesive layer(400) is formed between the upper electrode and the lens unit.</p> |
申请公布号 |
KR20100037950(A) |
申请公布日期 |
2010.04.12 |
申请号 |
KR20080097308 |
申请日期 |
2008.10.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, SEUNG SEOUP;YI, SUNG |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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