NOVEL RESIN COMPOSITION, COMPOSITE MATERIAL CONTAINING THE SAME AND USE OF THE COMPOSITE MATERIAL

摘要

Disclosed is a resin composition which is capable of firmly bonding a metal and a molding material. Also disclosed are a composite material containing such a resin composition and a use of such a composite material. Specifically disclosed is a resin composition containing an organic compound containing at least one secondary thiol group in a molecule, and a curable compound containing at least one hydroxy group in a molecule.