| 摘要 |
PURPOSE: A stacked semiconductor package including a pad to pad bonding structure and a wire bonding method of the same are provided to stably maintain a connection between a bonding pad and the pad of a wiring substrate by using a flat wire. CONSTITUTION: A semiconductor chip is stacked on a wiring substrate(100) and includes bonding pads(220, 320, 420). A flat wire(500) maintains the connection between the bonding pads and the pads of the wiring substrate. The flat wire is a single wire. The cross section of the flat wire has a rectangular shape. The width of the flat wire which is bonded to the bonding pad is smaller than or equal to the width of the bonding pads. |
