| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic circuit module, which facilitates inspecting a connection state to wiring patterns, in a plurality of semiconductor chips connected to predetermined wiring patterns of a circuit board, and to provide a method of inspecting the same. Ž<P>SOLUTION: In the electronic circuit module 1, the semiconductor chips 5, 6 are flip-chip-mounted on the circuit board 2, and both semiconductor chips 5, 6 are connected through the predetermined wiring pattern 14. An inspection terminal 14a conducted to the wiring pattern 14, a grounding terminal 9a for connecting the semiconductor chip 5 to a grounding land 21 of a mother board 20, and a grounding terminal 9b for connecting the semiconductor chip 6 to the grounding land 21, are prepared in the circuit board 2. The connection state of the semiconductor chip 5 to the wiring pattern 14 is inspected, by measuring the conductive condition between the inspection terminal 14a and the grounding terminal 9a. The connection state of the semiconductor chip 5 to the wiring pattern 14 is inspected, by measuring the conductive condition between the inspection terminal 14a and the grounding terminal 9b. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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