| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition allowing micro-fine working owing to its photosensitivity, developable by an dilute alkaline solution, curable at low temperatures (200°C or lower), rich in flexibility, excellent in electric insulation reliability, soldering heat resistance, stability against an organic solvent and flame retardancy, capable of reducing a warpage after cured, and excellent in tightness with a sealant. <P>SOLUTION: The problem is solved using the photosensitive resin composition containing at least (A) a polyimide precursor imidized partially and having an amido bond other than a polyamido acid region, (B) a photosensitive resin, and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2010,JPO&INPIT |
