| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package having a lead pin which has sufficient attachment strength and high reliability of electric connection. <P>SOLUTION: A semiconductor package includes a wiring substrate 10, a lead pin 60 fixed to a connection pad C1 on one surface side of the wiring substrate 10 by solder 34, and a reinforcing resin layer 70 formed on a surface of the wiring substrate 10 on which the lead pin 60 is provided and having a projection-shaped resin portion 72 which projects locally around the lead pin 60 and covers a side surface of a base portion side of the lead pin 60. The projection-shaped resin portion 72 has a top surface TS extending from an outer peripheral portion of the lead pin 60 to an outside, and a side surface S2 constituting a non-identical surface to the top surface TS. <P>COPYRIGHT: (C)2010,JPO&INPIT |
