| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a core substrate for a printed wiring board capable of fully maintaining heat resistance and electric characteristics, even if a wiring pattern is formed on a conductor layer by an etching process. <P>SOLUTION: The core substrate for the printed wiring board includes conductor layers 21 and 22 laminated so as to sandwich insulating layers 11 and 12 in between. The insulating layers include a sheet made of an inorganic fabric and/or a carbonic fabric, and a liquid crystal polyester soluble to a solvent. Preferably, the conductor layers is made of a copper foil and that the sheet is a glass fabric sheet, i.e., glass cloth. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
