| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a non-cured insulating material substrate from being shifted in the horizontal direction and the vertical direction. <P>SOLUTION: A method for manufacturing printed wiring board includes a 2-layer substrate generation process of generating a 2-layer substrate 60b, and a superimposing process of piling up at least one 2-layer substrate 60b, a bottom surface conductor plate and a peak surface conductor plate. The 2-layer substrate generation process includes a first conductor bump-forming step of forming a conductor bump 62 on a first conductor plate 61a, a first insulating material member-arranging step of arranging a non-cured insulating material member 63, a first pressurizing step of applying a pressurizing force between the conductor plates 61a and 61b, and a first curing step of curing the insulating material member 63. The superimposing process includes a second conductor bump-forming step of forming a conductor bump 62 on the 2-layer substrate 60b, a structure support bump-forming step of forming a structure support bump 67, a second insulating material member-arranging step of arranging a non-cured insulating material member 63, and a second pressurizing step of applying the pressurizing force between the respective 2-layer substrates 60b. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
