发明名称 |
FLEXIBLE MULTILAYER WIRING BOARD |
摘要 |
It is an object of the present invention to provide a flexible multilayer wiring board that can be easily reduced in thickness and that also has sufficient durability against repeated bending or heat shock. A preferred mode of the flexible multilayer wiring board comprises a flexible inner layer board obtained by forming an inner layer wiring on both sides of an insulating layer, an outer layer wiring situated on at least one side of the inner layer board, and insulating adhesive sheets lying between the inner layer board and outer layer wiring. One of the insulating adhesive sheets are composed of an imide group-containing polymer.
|
申请公布号 |
US2010084169(A1) |
申请公布日期 |
2010.04.08 |
申请号 |
US20080527908 |
申请日期 |
2008.02.20 |
申请人 |
NAKAMURA SHIGEHIRO;ITOU TOSHIHIKO;JOUMEN MASAYOSHI;MANSEI YOUICHIROU |
发明人 |
NAKAMURA SHIGEHIRO;ITOU TOSHIHIKO;JOUMEN MASAYOSHI;MANSEI YOUICHIROU |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|