发明名称 DISLOCATION ENGINEERING USING A SCANNED LASER
摘要 <p>A method for generating patterned strained regions in a semiconductor device is provided. The method includes directing a light-emitting beam locally onto a surface portion of a semiconductor body; and manipulating a plurality of dislocations located proximate to the surface portion of the semiconductor body utilizing the light-emitting beam, the light- emitting beam being characterized as having a scan speed, so as to produce the patterned strained regions.</p>
申请公布号 WO2010037577(A1) 申请公布日期 2010.04.08
申请号 WO2009EP59552 申请日期 2009.07.24
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;SCHWARZ, KLAUS;MADAN, ANITA;LIU, XIAO, HU;LAI, CHUNG WOH;SCOTT, JOHN, CAMPBELL;LI, JINGHONG 发明人 SCHWARZ, KLAUS;MADAN, ANITA;LIU, XIAO, HU;LAI, CHUNG WOH;SCOTT, JOHN, CAMPBELL;LI, JINGHONG
分类号 H01L21/268;H01L21/322;H01L29/10 主分类号 H01L21/268
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