| 发明名称 |
METHOD FOR PERFORMING CUTTING PROCESS OF SEMICONDUCTOR PACKAGES |
| 摘要 |
PURPOSE: A method for performing cutting process of semiconductor packages is provided to minimize thermal stress applied to a circuit board when cutting the circuit board having less resistance to heat. CONSTITUTION: A printed circuit board(PCB) is successively cut along the outline of a plurality of semiconductor packages by a laser beam(4). A mold is cut by projecting the laser beam along the outline of a plurality of semiconductor packages the several times consecutively.
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| 申请公布号 |
KR20100036626(A) |
申请公布日期 |
2010.04.08 |
| 申请号 |
KR20080095941 |
申请日期 |
2008.09.30 |
| 申请人 |
HANMISEMICONDUCTOR CO., LTD. |
发明人 |
LIM, TAE HYEONG;YOO, SANG HYUK |
| 分类号 |
H01L21/78;H01L21/301 |
主分类号 |
H01L21/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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