发明名称 BEAM PROCESSING APPARATUS, BEAM PROCESSING METHOD, AND BEAM PROCESSING SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To enable highly accurate processing without controlling a focal position during processing even if a substrate has deflection, when laser beam processing is performed from above by placing on the lower side a thin film formed on the large substrate. <P>SOLUTION: Disclosed is a beam processing apparatus that processes a layer to be processed 3 formed on one surface of a glass substrate 2, while irradiating the same with a beam. An objective optical apparatus 51 of a beam irradiating means 50 includes a conical lens as an axially-condensing optical element 52 in order to emit Bessel beams. A Bessel beam is an axially-condensed beam and the diameter of the beam, in particular the diameter of the region in the center where the intensity peaks, does not change greatly in the range where the distance from the conical lens is short. Therefore, even if the position of irradiating the objective optical apparatus 51 with the beam changes due to deflection of the substrate, the position would still be within the range of the focus depth of the Bessel beam, thus enabling highly accurate processing without having to implement control such as changing the focal position during processing. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010075996(A) 申请公布日期 2010.04.08
申请号 JP20090067023 申请日期 2009.03.18
申请人 MARUBUN CORP 发明人 NAKADA SATOKI;YAMAOKA YUTAKA;KINOMOTO RYO
分类号 B23K26/06;B23K26/00;B23K26/067;B23K26/08;B23K26/16;H01L21/28;H01L21/3205 主分类号 B23K26/06
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