| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To assure reliability of a memory device by surely estimating the damage on a joint part of the memory device mounted on a circuit board. <P>SOLUTION: In a memory device 100, a plurality of semiconductor memory packages, where a semiconductor memory 50 is mounted, are mounted on a printed board through a joint part. It includes a sensor part 10 for measuring physical quantity about the state of the memory device 100, a database 20 in which a damage estimating model base for estimating a damage at the joint part based on the physical quantity is accumulated, a damage estimating part 30 for calculating an estimated value of the damage of joint part based on the physical quantity by utilizing the damage estimating model base 20, and a control part 40 which selectively controls writing, reading, and erasing of electronic data to/from the semiconductor memory mounted on the semiconductor memory package, being mounted through the joint part, according to the estimated value. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
