发明名称 COOLING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a cooling device with superior pressure resistant performance and equipped with an expansion volume part with a high degree of freedom of installation space. Ž<P>SOLUTION: The cooling device 32 includes a secondary circuit 44 connecting a secondary heat exchange part 46 condensing a gaseous phase coolant into a liquid phase coolant and an evaporator EP vaporizing the liquid phase coolant into the gaseous phase coolant by liquid piping 48 and gas piping 50, communicating the liquid phase coolant from the secondary heat exchange part 46 to the evaporator EP via the liquid piping 48, and communicating the gaseous phase coolant from the evaporator EP to the secondary heat exchange part 46 via the gas piping 50. In the cooling device 32, the expansion volume part B1 relaxing internal pressure rising of the secondary circuit 44 is provided on the secondary circuit 44. The expansion volume part B1 is composed of a metal cylindrical body 54 having flexibility. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010078307(A) 申请公布日期 2010.04.08
申请号 JP20090144622 申请日期 2009.06.17
申请人 HOSHIZAKI ELECTRIC CO LTD 发明人 HIRANO AKIHIKO;SEKI KAZUYOSHI
分类号 F25B1/00;F25B7/00;F25B41/00 主分类号 F25B1/00
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