SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor chip package and a manufacturing method thereof are provided to set intensity suitable for a screen printing process by controlling the amount of first and second materials comprising a solder paste. CONSTITUTION: A printed circuit board(20) includes a first surface with an electrode pad(22) and a second surface with a contact pad(28). A semiconductor chip(24) is mounted on the first surface of the printed circuit board and is electrically connected to the electrode pad. A molding resin(29) seals the semiconductor chip. A connection member(30) is mounted on the second surface of the printed circuit board and is electrically connected to the contact pad. A board contact pad connected to the printed circuit board is formed inside a mother board through the connection member. A stress buffer member is attached t surround the upper side and the lower side of the connection member. The stress buffer member is connected to the board contact pad of the mother board and the second surface of the printed circuit board and is made of a first material and a second material. The first material is made of tin-based solder powder, and carbon-based conductive, and the polymer resin. The second material is made of silicon based material.