| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder printing method and a solder printer, capable of forming a uniform solder bump on a semiconductor wafer including a circular shape. Ž<P>SOLUTION: In this solder printing method, a mask 120 having an opening part 121 is mounted on the semiconductor wafers 110, 110a, 110b including the circular shape, a squeegee 10 deposited with a solder paste 130 is moved on the mask 120, and the solder bump is formed in the opening part 121. Pressure application control is executed to change target application pressure applied onto the squeegee 10, in response to a change of a contact area of the squeegee 10 with the mask 120 found based on a position of the squeegee 10, by detecting the position of the squeegee 10 with respect to the semiconductor wafers 110, 110a, 110b, when moving the squeegee 10 on the mask 120. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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