| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting table capable of obtaining stable measurement results by reducing the surface resistance of a top plate, reducing the manufacturing cost, and electrically insulating the top plate from a lower member with certainty even if a high voltage is impressed to the top plate; and of preventing leakage current from the top plate with certainty. SOLUTION: The mounting table 20 comprises: a top plate 21 consisting of oxygen-free copper having a mounting surface for a semiconductor wafer, an insulating film 22 consisting of alumina that continuously covers the lower surface 21A of the top plate 21 and the lower portion of the side surface 21B, a cooling jacket (a lower plate-like object) 23 consisting of oxygen-free copper arranged to contact the insulating film 22. The purity of the alumina is at least 99.99 wt.%. The lower surface 21A of the top plate 21 is formed to a thickness of 0.4 mm or more and less than 1.0 mm. COPYRIGHT: (C)2010,JPO&INPIT |
