| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problems: building an ISP (image signal processor) in a solid-state image pickup device causes upsizing of a peripheral circuit, which leads to upsize a chip of the solid-state image pickup device. SOLUTION: A flat plane and at least one inclined plane which continues to the flat plane and loweres as receding from the flat plane, are formed on the surface of a semiconductor substrate. Photosensor arrays are formed on the flat plane of the semiconductor substrate. Transistors are formed on the inclined plane of the semiconductor substrate. COPYRIGHT: (C)2010,JPO&INPIT |
