| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection device and method which can be used for a device having extremely large scale and extremely small pitch of all the kinds which requires "flip-chip" interconnection. <P>SOLUTION: The connection device between two components (1, 1') has a hollow conductive insert (2) into which is fitted another conductive insert (3), and the electrical connection between the two inserts is provided by means of a solder element (4). A method for hybridizing between two components provided with the inserts is also provided. <P>COPYRIGHT: (C)2010,JPO&INPIT |
