| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrode structure for preventing a through electrode from being damaged by stress and preventing an electrode pad from separating from a substrate, and to provide an electronic device. <P>SOLUTION: The electrode pad 6 has a cutout 6a on the side, and an insulating layer 8, which is interposed between the electrode pad 6 and a package, is also disposed in the cutout 6a. In this manner, the electrode pad 6 is provided so that the insulating layer 8 is sandwiched by the cutout 6a, and is disposed so that one portion is buried in the insulating layer 8, thus strongly maintaining the adhesive force of the electrode pad 6 to the insulating layer 8. <P>COPYRIGHT: (C)2010,JPO&INPIT |
