| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for a semiconductor device capable of manufacturing an optical semiconductor device at a high yield having excellent light emitting performance by connecting a semiconductor element with a stem side or favorably bonding at least either of a bonding wire and a lead terminal extending from the semiconductor element and an optical semiconductor device using the package at a low cost. Ž<P>SOLUTION: In the package, organic films 8 are formed on surfaces of an element mounting part 3a of a heat sink 3 on the stem 2c and two lead terminals 2a by the self-organization of a functional organic molecule 8. The molecule 8 has a chemical structure that a first functional group Al exhibiting a bonding aspect of a coordinate bond of a metallic bond, a hydrogen bond or a metallic complex at least one of the stem 2c side and the lead terminal 2a is disposed at one end of a principle chain B1 and a second functional group C1 exhibiting an antifouling property is disposed at the other end. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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