| 摘要 |
An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process (e.g., by diffusion bonding) and/or through a dynamic bonding process (e.g., by brazing). The embedded sensor or other desired device is provided on a substrate through any know or later-developed method (e.g., a photolithography or conductive ink printing process). A cover is then bonded to the substrate using a solid-state bonding process and/or a dynamic bonding process. The solid-state bonding process and/or dynamic bonding process may include providing heat and/or pressure to the substrate, the cover and/or a bonding agent (e.g., a filler metal or alloy) to bond the substrate and the cover together.
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