| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce a mounting area of a semiconductor package and can reduce the width of a printed board in compliance with the width of a mounting surface. <P>SOLUTION: A package substrate 30 mounted with a semiconductor chip seals the semiconductor chip inside therein and has first junction electrodes 32 arranged on the backside 30a and second junction electrodes 33 arranged on a pair of side faces 30b opposite to each other in the X direction. A printed board 28 has first land electrodes 40 arranged on the top face 28a and second land electrodes 41 arranged on a pair of side faces 28b opposite to each other in the X direction. The package substrate 30 and the printed board 28 have nearly the same width in the X direction. The first junction electrodes 32 and the first land electrodes 40 are electrically and mechanically joined with solder balls 34, and the second junction electrodes 33 and the second land electrodes 41 are electrically and mechanically joined with a solder paste 50. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
