PRINTED WIRING BOARD MANUFACTURING METHOD

摘要

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board manufacturing method for preventing damage to the transfer surface of a resin layer upon providing a circuit on the resin layer with transfer. Ž<P>SOLUTION: The printed wiring board manufacturing method is provided. The transfer circuit 3 is provided on the surface of a metal material 1. A metal film 2 is provided on the surface of the metal material 1 and on the whole surface of the transfer circuit 3 to form a transfer substrate 4. The transfer substrate 4 is pasted to the resin layer 5 and the transfer circuit 3 is embedded into the resin layer 5 via the metal film 2. Then, the metal material 1 is separated. The metal film 2 which is not embedded in the resin layer 5 is removed by etching. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž