| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-faced adhesive film which suppresses the influence of foreign matter occurring together with processing, such as perforating, when used as an adhesive film for adhering plural elements to a substrate and of which the deformation by heating is suppressed. SOLUTION: The double-faced adhesive film comprises a support film 10, two adhesive layers 21 and 22 laminated on both sides of the support film 10, and cover films 31 and 32 which are laminated to the adhesive layers 21 and 22, each of the cover films on the side reverse to the support film 10. The double-faced adhesive film is used for bonding a semiconductor element and/or an MEMS element to a substrate. COPYRIGHT: (C)2010,JPO&INPIT |
