发明名称 POLYGLYCOL ACID RESIN COMPOSITION AND MOLDED BODY THEREOF
摘要 Disclosed is a polyglycol acid resin composition which has excellent moldability and exhibits good barrier properties and transparency after molding.  A molded body of the polyglycol acid resin composition is also disclosed. The resin composition is obtained by blending a polylactic acid having a mass average molecular weight Mw of 100,000-1,000,000 into a polyglycol acid having a mass average molecular weight Mw of 100,000-1,000,000 so that the polylactic acid content is within the range of 5-30% by mass, and then melt-mixing the blend, for example, at a temperature of 230-270°C so that the temperature lowering crystallization peak temperature Tc of the resulting resin composition as measured by differential scanning calorimetry is lower than that of the polyglycol acid by itself by 3-18°C.
申请公布号 WO2010038537(A1) 申请公布日期 2010.04.08
申请号 WO2009JP63334 申请日期 2009.07.27
申请人 KUREHA CORPORATION;ITOH DAISUKE;HAMADA NAOKO 发明人 ITOH DAISUKE;HAMADA NAOKO
分类号 C08L67/04;C08J5/00;C08L101/16 主分类号 C08L67/04
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