发明名称 Halbleitervorrichtung
摘要 In a peripheral portion of an IGBT chip, an intermediate potential electrode (20) is provided between a field plate (14) and a field plate (15) on a field oxide film (13), to surround an IGBT cell. The intermediate potential electrode (20) is supplied with a prescribed intermediate potential between the potentials at an emitter electrode (10) and a channel stopper electrode (12) from intermediate potential applying means that is formed locally in a partial region on the chip peripheral portion.
申请公布号 DE102004059453(B4) 申请公布日期 2010.04.08
申请号 DE20041059453 申请日期 2004.12.09
申请人 MITSUBISHI DENKI K.K. 发明人 TAKAHASHI, TETSUO
分类号 H01L21/328;H01L29/06;H01L21/331;H01L29/40;H01L29/739;H01L29/78 主分类号 H01L21/328
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