| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plastic package which exhibits excellent heat dissipation properties of a light-emitting diode (LED) when the light-emitting diode is fixed to a package, and to provide a method of manufacturing the plastic package. <P>SOLUTION: The plastic package includes a first lead, a second lead, and plastic for molding them. The first lead consists at least of a first protrusion, a first lead heat dissipation part provided continuously to a first protrusion, and a first lead terminal. The second lead consists at least of a second protrusion, a second lead heat dissipation part provided continuously to the second protrusion, and a second lead terminal. <P>COPYRIGHT: (C)2010,JPO&INPIT |
