| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To accurately print printed solder balls while solving a problem that a solder bump formed on an electrode part of a semiconductor chip has recently become fine and a solder ball has become fine in printing by using the solder ball. <P>SOLUTION: A solder ball filling member including a plurality of semi-spiral shaped wires is arranged on a print head for printing the solder ball in place of a conventional squeegee, and the solder ball filling member is pressed to a mask surface by a predetermined pressing force. Thereby, a rotational force is applied on the solder ball in a space formed of the wires, and the solder balls are dispersed moderately, and the solder balls are pressed in mask opening parts. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
