| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an etching composition for copper, copper/molybdenum or a copper/molybdenum alloy. <P>SOLUTION: The etching composition for a copper membrane, a copper/molybdenum membrane or a copper/molybdenum alloy membrane includes, based on the total weight of the composition, 12-35 wt.% hydrogen peroxide, 0.5-5 wt.% sulfate, 0.5-5 wt.% phosphate, 0.0001-0.5 wt.% fluoride that can provide fluoro ion, 0.1-5 wt.% a first water-soluble cyclic amine, 0.1-5 wt.% chelating agent, 0.1-5 wt.% a second water-soluble cyclic amine, 0.1-5 wt.% glycol, and deionized water so that the total weight of the entire composition is adjusted to 100 wt.%. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
