发明名称 LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT
摘要 A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.
申请公布号 US2010083500(A1) 申请公布日期 2010.04.08
申请号 US20090477471 申请日期 2009.06.03
申请人 LIN KUO-LEN;LIN CHEN-HSIANG;WANG HWAI-MING;HSU KEN;CHENG CHIH-HUNG 发明人 LIN KUO-LEN;LIN CHEN-HSIANG;WANG HWAI-MING;HSU KEN;CHENG CHIH-HUNG
分类号 B21D53/02 主分类号 B21D53/02
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