发明名称 |
LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT |
摘要 |
A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.
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申请公布号 |
US2010083500(A1) |
申请公布日期 |
2010.04.08 |
申请号 |
US20090477471 |
申请日期 |
2009.06.03 |
申请人 |
LIN KUO-LEN;LIN CHEN-HSIANG;WANG HWAI-MING;HSU KEN;CHENG CHIH-HUNG |
发明人 |
LIN KUO-LEN;LIN CHEN-HSIANG;WANG HWAI-MING;HSU KEN;CHENG CHIH-HUNG |
分类号 |
B21D53/02 |
主分类号 |
B21D53/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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