发明名称 ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE AND METHOD FOR MANUFACTURING CONNECTED STRUCTURE USING THE ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE
摘要 <p>Disclosed is an anisotropic electroconductive adhesive that,  even when a heating tool is contacted and pressed at a slow speed, can realize high electrical connection reliability.  The anisotropic electroconductive adhesive comprises an insulating adhesive component and electroconductive particles dispersed in the insulating adhesive component.  The insulating adhesive component comprises a radical polymerizable compound, a radical initiator, and a film forming resin.  The lowest melt viscosity of the anisotropic electroconductive adhesive is in the range of 100 to 800 Pa·s, and the temperature at which the adhesive exhibits the lowest melt viscosity is in the range of 90 to 115°C.</p>
申请公布号 WO2010038753(A1) 申请公布日期 2010.04.08
申请号 WO2009JP66987 申请日期 2009.09.29
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION;SATO, DAISUKE;HAYASHI, SHINICHI 发明人 SATO, DAISUKE;HAYASHI, SHINICHI
分类号 C09J201/00;C09J4/02;C09J5/06;C09J9/02;C09J109/00;C09J163/00;C09J171/12;C09J175/16;H01B1/22;H01R11/01;H01R43/00;H05K1/14;H05K3/36 主分类号 C09J201/00
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