发明名称 COMBINATION IC CARD AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a combination IC card which has a card base made of a resin sheet having a high heatproof temperature and which is provided on its surface with image receiving layers for sublimation heat transfer printing and thermal fusion heat transfer printing, and a method of manufacturing the same. <P>SOLUTION: Crystalline polyester resin sheets having a heatproof temperature higher than the temperature at which the image receiving layers can receive images are used as an antenna sheet 13, an image-receiving-layer-equipped sheet 11a, and an image-receiving-layer-equipped sheet 11b. Non-crystalline polyester resin sheets having a heatproof temperature lower than the heat deterioration temperature of the image receiving layers and 35°C or more lower than heating temperature during stacking are used as an adhesive sheet 12a and an adhesive sheet 12b on which the resin sheets are stacked. The sheets are stacked at temperatures not higher than the heat deterioration temperature of the image receiving layers. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010079610(A) 申请公布日期 2010.04.08
申请号 JP20080247345 申请日期 2008.09.26
申请人 NEC TOKIN CORP 发明人 SATO TAKASHI
分类号 G06K19/077;B42D15/10;G06K19/07 主分类号 G06K19/077
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