| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module not requiring a special process for connecting a ground terminal to a conductor film. SOLUTION: The high-frequency module includes a frame 15 mounted on the top face of a substrate 12, a plurality of electronic components 3 in the hole 15a disposed in the frame 15 and mounted on the top face of the substrate 12, a resin burying part 16 disposed in the hole 15a and in which the electronic components 3 are buried, the conductor film 19 disposed on the resin burying part 16, and the ground terminal 18 disposed on the upper face of the substrate 12, wherein a conductor 17a is disposed at least on the inside surface of the hole 15a, and the conductor film 19 and the ground terminal 18 are connected via the conductor 17a. Accordingly, no special process is required for connecting the conductor 17a to the conductor film 19. COPYRIGHT: (C)2010,JPO&INPIT |
