| 摘要 |
The present invention discloses a method for manufacturing ultra-thin reinforced membranes from a SOI wafer having a front side and a back side, the front side having an etch stop layer buried under a device layer, provided for by forming reinforcement bars by etching openings in the device layer down to the etch stop layer, filling the openings at least partially by deposition of a first filler, and then polishing the top surface to the silicon surface before depositing a membrane material.
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