| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide hotmelt adhesives. <P>SOLUTION: There are provided new hotmelt adhesives that are based on a specific ethylene-vinyl acetate copolymer, a styrene block copolymer, and a tackifying resin. These hotmelt adhesives are outstandingly suitable for bonding substrates, more particularly for bonding films to substrates. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
