| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable bonding of a wood molding material and a wood in a short time by obtaining a sufficient calorific value, to upgrade the productivity of a wood composite board. <P>SOLUTION: An adhesive 6 is applied to one adhesive surface 4a of the wood molding material 4 or the wood 1, then an aqueous electrolyte solution 3 is applied to the other adhesive surface 1a, and the lapped adhesive surfaces 4a and 1a are pressurized. Further, the lapped adhesive surfaces are subjected to high-frequency electric heating, to bond the wood molding material and the wood together. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
