发明名称 PLASTICIZER-CONTAINING POLYAMIDE RESIN COMPOSITION, AND MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a plasticizer-containing polyamide resin composition which exhibits no bleed-out of a plasticizer, can attain sufficient high molecular weight as compared with conventional polyamide 92, and has a wide moldable temperature range estimated from the difference of melting point and thermal decomposition temperature and is excellent in melt moldability, and further has better chemical resistance, flexibility, hydrolysis resistance etc. than a conventional aliphatic polyamide resin without impairing low water absorption properties seen in a linear aliphatic polyoxamide resin. SOLUTION: The plasticizer-containing resin composition includes a polyamide resin and a plasticizer. In the polyamide resin, the dicarboxylic acid component is composed of oxalic acid; the diamine component is composed of C9 diamine (a mixture of 1, 9-nonanediamine and 2-methyl-1, 8-octanediamine) and 1, 6-hexanediamine; and the molar ratio of the C9 diamine to 1, 6-hexanediamine is 1:99 to 99:1. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010077221(A) 申请公布日期 2010.04.08
申请号 JP20080244930 申请日期 2008.09.24
申请人 UBE IND LTD 发明人 MAEDA SHUICHI;KURACHI KOICHIRO;SHIMOKAWA MASAHITO;NAKAGAWA TOMOYUKI;OKUSHITA YOJI;FUJIMURA HIDEKI
分类号 C08L77/06;C08G69/26 主分类号 C08L77/06
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