| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a circuit board in which the number of layers can be optimized on a plurality of rigid parts; a method for manufacturing the circuit board; and an electronic device having the circuit board. Ž<P>SOLUTION: The circuit board 100 includes: a rigid flexible board unit 110 having a first rigid part 130 composed of a given number of layers, a second rigid part 140 composed of the same number of layers as the first rigid part 130, and a flexible first flex part 160 connecting the first rigid part 130 to the second rigid part 140; and a rigid board unit 120 which is overlaid on the first rigid part 130 to be fixed and electrically connected thereto. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
