| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for testing semiconductor devices, which suppresses an increase in the time required for simultaneously testing multiple semiconductor devices on a semiconductor wafer by using a probe card. Ž<P>SOLUTION: The method for simultaneously conducting a contact test on the semiconductor devices 2 formed on the semiconductor wafer 1 includes a process of determining the difference between the maximum contact voltage of non-defective semiconductor devices and that of defective semiconductor devices, of correcting a standard value range for semiconductor devices 2, each having a contact voltage out of the standard value range, on the basis of the voltage difference, and then of applying the corrected standard value range to the semiconductor devices determined as defectives. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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