| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board which can manufacture the high precision printed circuit board in which yield, lead time, and precision compensation are improved. Ž<P>SOLUTION: The method for manufacturing the printed circuit board includes an impedance control etching step S100 which has a procedure which consists of: an etching step S25 of performing copper thin film etching for overall range of the board; an etch resist exfoliating step S26 of exfoliating a resist film of a predetermined measuring terminal part; an impedance value-measuring step S27 of obtaining measured data by measuring the impedance of a circuit pattern which has the measuring terminal part; a measured data processing etching condition step S29 of obtaining points of additional etching by performing data processing based on the measured data; and a selective etching step S30 of performing selective etching for the circuit pattern selected based on the measured data processing etching condition. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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