| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition having heat resistance and flex resistance; and to provide a cured article using the resin composition as well as a flexible copper-clad laminate plate and a flexible printed board using the resin composition. Ž<P>SOLUTION: The resin composition contains a compound which has an ethynyl group having a constitutional unit represented by general formula (3). In the general formula (3), A<SB>0</SB>represents a (1+m)-valent hydrocarbon group, excluding the case where one carbon atom in A<SB>0</SB>has 3 or more aromatic rings directly bonded thereto, A<SB>1</SB>represents a single bond or a divalent hydrocarbon group, R<SB>1</SB>represents hydrogen or hydrocarbon group, Ar represents a (a+1)-valent aryl group or an aromatic heterocyclic group, X<SB>0</SB>, X<SB>1</SB>each independently represents a divalent linking group, a, l, m, n each independently represents an integer of not less than 1 and not more than 5, excluding the case where m and n are 1 at the same time. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
