| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can collectively be reflowed at a low temperature with low temperature melting solder particles, when an electronic circuit containing parts not resisting to high temperature is mounted, and can mount parts in excellent strength and toughness. SOLUTION: The thermosetting resin composition comprises a metal filler component, a flux component, and a thermosetting resin binder, characterized by using at least one of Bi and In as the metal filler component and further using at least one of diglycolic acid represented by structural formula (1): HOOCH<SB>2</SB>C-O-CH<SB>2</SB>COOH, thiodiglycolic acid represented by structural formula (2): HOOCH<SB>2</SB>C-S-CH<SB>2</SB>COOH, and dithiodiglycolic acid represented by structural formula (3): HOOCH<SB>2</SB>C-S-S-CH<SB>2</SB>COOH as the flux component. COPYRIGHT: (C)2010,JPO&INPIT |
