发明名称 |
METHOD OF FABRICATING BACKSIDE ILLUMINATED IMAGE SENSOR |
摘要 |
A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate with a front surface and a back surface; forming a first alignment mark for global alignment on the front surface of the substrate; forming a second alignment mark for fine alignment in a clear-out region on the front surface of the substrate; aligning the substrate from the back surface using the first alignment mark; and removing a portion of the back surface of the substrate at the clear-out region for locating the second alignment mark.
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申请公布号 |
US2010087029(A1) |
申请公布日期 |
2010.04.08 |
申请号 |
US20090634080 |
申请日期 |
2009.12.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
FU SHIH-CHI;SHIAU GWO-YUH;YAO LIANG-LUNG;HSIEH YUAN-CHIH;SHIU FENG-JIA |
分类号 |
H01L31/18 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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