发明名称 METHOD OF FABRICATING BACKSIDE ILLUMINATED IMAGE SENSOR
摘要 A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate with a front surface and a back surface; forming a first alignment mark for global alignment on the front surface of the substrate; forming a second alignment mark for fine alignment in a clear-out region on the front surface of the substrate; aligning the substrate from the back surface using the first alignment mark; and removing a portion of the back surface of the substrate at the clear-out region for locating the second alignment mark.
申请公布号 US2010087029(A1) 申请公布日期 2010.04.08
申请号 US20090634080 申请日期 2009.12.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 FU SHIH-CHI;SHIAU GWO-YUH;YAO LIANG-LUNG;HSIEH YUAN-CHIH;SHIU FENG-JIA
分类号 H01L31/18 主分类号 H01L31/18
代理机构 代理人
主权项
地址