发明名称 |
Zigzag Pattern for TSV Copper Adhesion |
摘要 |
A system and method for forming a TSV contact is presented. A preferred embodiment includes a TSV in contact with a portion of the uppermost metal layer of a semiconductor die. The interface between the TSV conductor and the contact pad is preferably characterized by a non-planar zigzag pattern that forms a grid pattern of contacts. Alternatively, the contacts may form a plurality of metal lines that make contact with the contact pad.
|
申请公布号 |
US2010084747(A1) |
申请公布日期 |
2010.04.08 |
申请号 |
US20080245505 |
申请日期 |
2008.10.03 |
申请人 |
CHEN CHIH-HUA;CHEN CHEN-SHIEN;KUO CHEN-CHENG;SHEN WEN-WEI |
发明人 |
CHEN CHIH-HUA;CHEN CHEN-SHIEN;KUO CHEN-CHENG;SHEN WEN-WEI |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|