| 发明名称 |
PRODUCTION PROCESS FOR SURFACE-MOUNTING CERAMIC LED PACKAGE, SURFACE-MOUNTING CERAMIC LED PACKAGE PRODUCED BY SAID PRODUCTION PROCESS, AND MOLD FOR PRODUCING SAID PACKAGE |
| 摘要 |
<p>The present invention is related to a surface-mounting ceramic LED package (138) and a method for its production comprising: layering a ceramic green sheet (102) which has a hole (106) and a second ceramic green sheet (104), inserting a mold (114) with a groove (128) to form a partition (136) in the bottom of the ceramic green sheet substrate (112), and firing the ceramic green sheet substrate.</p> |
| 申请公布号 |
WO2010040121(A1) |
申请公布日期 |
2010.04.08 |
| 申请号 |
WO2009US59490 |
申请日期 |
2009.10.05 |
| 申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY;NAKAJIMA, NAOTO;TSUNODA, SHUICHI;INABA, AKIRA |
发明人 |
NAKAJIMA, NAOTO;TSUNODA, SHUICHI;INABA, AKIRA |
| 分类号 |
H01L25/075;H01L21/48;H01L33/48;H01L33/60;H05K1/03;H05K3/00 |
主分类号 |
H01L25/075 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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