POLYAMIDE RESIN, RESIN COMPOSITION THEREOF, FLAME-RETARDANT ADHESIVE COMPOSITION AND ADHESIVE SHEET MADE OF SAID COMPOSITION, COVERLAY FILM, AND PRINTED WIRING BOARD

摘要

Provided is a polyamide resin that simultaneously satisfies requirements for heat resistance, insulation reliability, and solvent solubility, and that is ideal for heat-resistant adhesives for printed wiring board applications. Also provided is a flame-retardant non-halogen adhesive composition made from ingredients that are soluble in general-purpose solvents, and which not only demonstrates stable characteristics but also demonstrates excellent flame-retardancy, solder heat resistance, adhesivity, and electric insulating properties when used for flexible printed wiring boards, for example. Disclosed is a polyamide resin characterized in that the polyamide resin is obtained by reacting acid components (a)-(c) given below and a diisocyanate or diamine having an aromatic ring, and in that when the total of all the acid components of said polyamide resin is 100 mol%, the ratios of the respective acid components are 3-10 mol% (a), 10-80 mol% (b), and 10-87 mol% (c). (a) An acrylonitrile-butadiene rubber having carboxyl groups at both ends (b) An aliphatic dicarboxylic acid with a carbon number of 4-12 (c) A polycarboxylic acid anhydride with an aromatic ring